• LED Chips
• Components for Display
• Components for photoelectron
• Components for Lighting
• LED Modules
• Third-generation semiconductor
The CHIP LED Packaging Division has advanced LED packaging technology such as plastic package, high speed cutting dicing and so on, which ensures high lumen efficiency and good lumen maintainance. It main products includes 1005, 1608(0.3T-0.8T), 2012, 3215, infrared, photosensitive.
The White LED Packaging Division has advanced phosphor mixing and coating equipment, and leading technology on thermal dissipation LED packages such as flip-chip, chip-on-board and CSP, which ensure high lumen efficiency and good lumen maintainance. NationStar’s small and middle power white LEDs have been well adopted into a wide range of applications such as illuminaire, lighting fixtures and LCD TV backlight.
The LED Module Division specializes in developing and producing LED display modules, backlight, and light bars, with advanced high-speed SMT lines and automatic backlight-lense mounting line. Products are widely applied to various home electronics, such as air conditioners, LCD TV and billboards.
The National Star third-generation semiconductor project team was established in 2019. We focus on the packaging design and manufacturing of high-reliability power devices. As one of the important directions of our company, the third-generation semiconductor cover a large series of product concaining SiC SBD and MOSFET, SiC modules, and GaN FET, and the package form include DFN 5*6, DFN8*8, TO-220 , TO-247 2L/3L/4L, TO 252 and so on. Our company has many advanced manufacturing equipments and reliability verification equipments against the standard ACE-0101. Our products can be widely used in lighting and high-power drive markets, solar power generation, photovoltaic inverters, energy storage, charging piles, power grid transmission, wind power generation and other fields. At present, our company has already formed a wide and high-quality product layout, and we maintain a good relationship with many well-known third-generation semiconductor manufacturers.
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